HVAC
The companies featured on PressReleaseFinder are active in several industries.
22 Mar 2022
Perstorp welcomes Valentina Serra Holm as Vice President Engineered Fluids
Perstorp has appointed Valentina Serra Holm as Vice President Engineered Fluids, where she will strengthen the group’s focus on key market segments with her experience and expertise from the industry.
1 Jun 2021
Henkel’s Technomelt Low Pressure Molding technology meets latest demands for encapsulation of electronics and medical components
Henkel’s Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding.
TE Connectivity (TE), a world leader in connectivity and sensors, has introduced LUMAWISE Type Z LED holders to provide quick and easy mechanical and electrical connections of chip-on-board (COB) LED arrays in a wide variety of lighting designs. Customers can use the new LED holders to develop Zhaga-compliant modules.
TE Connectivity (TE), a world leader in connectivity and sensors, is introducing 
TE Connectivity (TE), a world leader in connectivity and sensors, today announced general availability of AmbiMate MS4 sensor module development kits. The kits allow global engineering and development teams to build prototypes and evaluation boards for systems incorporating TE’s state-of-the-art AmbiMate MS4 Series sensor modules.
TE Connectivity (TE), a world leader in connectivity and sensors, has introduced a development kit for its new LUMAWISE Drive LED Holder Type Z50, enabling luminaire designers to purchase a single unit for desktop testing, product evaluation and luminaire prototyping. Each kit contains an LED holder, a cable assembly and a thermal interface material.