Engineering
The companies featured on PressReleaseFinder are active in several industries.
9 Mar 2026
Syensqo secures new long-term agreement with Boeing, reinforcing aerospace as a core growth driver
Syensqo has been awarded a new multi-year contract by Boeing to continue providing advanced material solutions supporting Boeing commercial and defense programs. As Syensqo’s largest end market, representing approximately 20% of its net sales, the aerospace end market is a key driver of the Group’s innovation, growth, and long-term value creation. The agreement covers a range of applications including primary and secondary structures, interiors, and surfacing.
5 Mar 2026
Belden Enables Safer, Smarter IT/OT Networks with Virtual Firewall and Digital I/O Module Innovations
Belden Inc. (NYSE: BDC), a leading global provider of complete connection solutions, today announced the launch of new products designed to provide flexible and scalable cybersecurity for operational technology environments and enhance network efficiency.
At JEC World 2026, Syensqo will demonstrate how its advanced composite technologies are accelerating high-rate manufacturing, enabling mission-critical performance, and advancing circularity across aerospace and automotive applications.
Belden Inc. (NYSE: BDC), a leading global provider of complete connection solutions, today announced that Jeff Winter has joined the company as Vice President of Commercial Strategy.
Beaulieu International Group (B.I.G.) today announces it has signed a share purchase agreement to acquire all shares of IFG Asota GMBH, an Austria-based fibre company and a key player in the global synthetic staple fibres market. This strategic acquisition strengthens Beaulieu’s Fibres Division (BFI) and marks an important step in its ambition to become the world’s most trusted partner for sustainable nonwoven solutions.
SABIC, a global leader in the chemical industry, has announced another incremental expansion phase for the production of its specialty oligomers based on polyphenylene ether (PPE) technology. The commitment builds on previous capacity increases in Asia and meets with the rapidly growing demand for high-performance printed circuit boards (PCBs) in data centers serving the needs of artificial intelligence (AI) and 5G applications.