Archroma announces distribution agreement with Van Horn, Metz & Company for its Mowilith® emulsions in the US market

Water resistance test. Left side showing high gloss, varnish with Mowilith® LDM 7601. Right side showing low gloss on standard wood varnish. 
(Photo: Archroma)Archroma, a global leader in specialty chemicals towards sustainable solutions, today announced that it has entered an agreement with specialty raw material distributor Van Horn, Metz & Company for the distribution of its Mowilith® emulsions in the United States.

New sales and marketing leadership appointments at Avery Dennison Label and Packaging Materials EMENA

Burak Sahbaz, VP, Sales LPM EMENA. 
(Photo: Avery Dennison, PR453)Avery Dennison’s Label and Packaging Materials (LPM) division in EMENA region is making two new key appointments effective June 1, 2021.

Perstorp announces production capacity increase for 2-Ethylhexanoic Acid (2-EHA)

Perstorp announces production capacity increase for 2-Ethylhexanoic Acid (2-EHA). 
(Photo: Perstorp)Perstorp will substantially expand its production capacity of 2-Ethylhexanoic Acid (2-EHA) from 2022, to meet increasing market needs. The investment and expansion are within the framework of Perstorp’s existing production plants and implementation has already started.

SABIC certified renewable polymers used in new more sustainable Delizio coffee capsules

Certified renewable polymers from SABIC were key to the development of a new generation of more sustainable coffee capsules for use in Delica’s Delizio coffee capsule machine system. 
(Photo: Delica AG)SABIC, a global leader in the chemical industry, today announced that Delica AG will be introducing a new range of more sustainable coffee capsules based on SABIC’s certified renewable polymers for use in its proprietary Delizio capsule machines. Delica will be using certified renewable polypropylene (PP) resins in the coffee capsules. The bio-feedstock based “second generation” materials are part of SABIC’s TRUCIRCLE™ portfolio of circular products and services. The new capsules were introduced in the market in April 2021 and replace fossil-based virgin PP.

Compliant analysis without helium: Malvern Panalytical launches even smarter Epsilon 1

Compliant analysis without helium: Malvern Panalytical launches even smarter Epsilon 1.
(Photo: Malvern Panalytical)Malvern Panalytical today officially launches the Epsilon 1. The system is pre-calibrated in the factory and is an out-of-the-box solution for the analysis of low sulphur content in fuels. The Epsilon 1 is the first analytical solution for this purpose without the need for helium, which makes the Epsilon 1 easy to operate with extreme low costs per analysis. It is the ideal analytical solution to comply to the ISO13032 standard and similar test methods.

Polymershapes supports sustainable future of the printing industry as new SGP Patron

SGPThe Sustainable Green Printing Partnership (SGP), the leading certification authority in sustainable printing, announced today Polymershapes of Charlotte, North Carolina as a gold SGP Patron.

Archroma launches new grade in Appretan® NTR range of water-based polymeric binders based on renewable natural ingredients

Archroma’s new grade in Appretan® NTR range of water-based polymeric binders based on renewable natural ingredients is available in two new compostable binder systems especially designed for nonwoven cleaning rags and food filters: NATURE BOUND and RAG N’ ROLL. 
(Photo: Archroma)Archroma, a global leader in specialty chemicals towards sustainable solutions, today announced the launch of Appretan® NTR6304, a water-based polymeric binder based on renewable natural ingredients. The new product in the Appretan® NTR range offers a soft handfeel option and displays an even higher content based on natural, renewable raw materials.

Henkel’s Technomelt Low Pressure Molding technology meets latest demands for encapsulation of electronics and medical components

Low pressure molding process: The bare electronics are inserted into a predesigned mold set. Technomelt encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly. 
(Photo: Henkel, PR089)
Henkel’s Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding.