19-12-2003
Axxicon Mould Technology present at MedTec Exhibition & Conference in Stuttgart-Germany
Axxicon Mould Technology will be present at the MedTec Exhibition & Conference on stand number 1049, hall 5.2 (9-11 March 2004, Messe Stuttgart, Stuttgart-Germany).
19-12-2003
Faster, lower cost glass panel bonding solution for demountable partitions
Demountable partition systems provide companies with almost limitless possibilities for the design and redesign of their office layouts, enabling the best use of available space as they grow in size or reorganize their functional groupings.
19-12-2003
Husky announces new facility in Luxembourg
DUDELANGE, Luxembourg — Husky Injection Molding Systems has announced plans to build a new PET mold facility on its Luxembourg manufacturing campus. The new facility is scheduled to open in spring 2006.
17-12-2003
Mexican production facility underlines conTeyor’s commitment to support its North American customers
Merelbeke, Belgium, Dec. 15, 2003 – conTeyor, the leading European provider of textile-based packaging and materials handling solutions to automotive OEMs and tiers, has started-up a production facility in Mexico on August 1, 2003. The facility is located at Irapuato, two and a half hours drive North of Mexico City.
17-12-2003
Distrupol gives new meaning to networking with telemetry based vendor managed inventory at Boots plc
As a leading polymer distributor, technical service provider and application development partner, Distrupol is focused on the enhancement of systems that give real advantages to customers. One key, and now proven, advantage is that delivered by its telemetry based vendor managed inventory system. This telemetric system, based on the microwave measurement of polymer stock level in a customer’s silo, allows for the automatic replenishment of stock without need of human intervention.
16-12-2003
Core module bonding solutions that meet all Smart Card application needs
The development of smarter and greater data-rich modules has presented the smart card industry with a range of new challenges. Chief among them is the attachment of the micro modules to the broader span of plastic substrates now being exploited by the industry. Traditionally, electronically read cards have been produced in PVC but evolution of the technology, coupled with the demand for greater durability, ever higher levels of security and enhanced aesthetics capability, has resulted in the increasing use of high tech engineering plastics that are difficult to bond and which require more sophisticated adhesive solutions.
15-12-2003
Borouge developing into world scale petrochemical complex
Borouge, Borealis’ joint venture with ADNOC, is expanding its existing Borstar capacity and studying further expansion to form a world scale petrochemical complex at Ruwais, Abu Dhabi in the UAE. Building on the successful start up and first two years of operation, increasing market demand for enhanced polyolefins and more feedstock becoming available, the next steps are underway to expand the Borouge petrochemical complex.
15-12-2003
DA DSM ENGINEERING PLASTICS UN NUOVO GRADO DI PBT ARNITE® PER SCATOLE DI MOTORIDUTTORI NEL SETTORE AUTOMOTIVE
DSM Engineering Plastics ha introdotto un nuovo grado di polibutilentereftalato (PBT) Arnite® destinato alla realizzazione di scatole di motoriduttori nel settore automotive. Il nuovo grado possiede eccezionale rigidità, stabilità dimensionale e duttilità, e in più riduce i costi totali di montaggio e il peso dei pezzi prodotti; colma quindi il divario tra le prestazioni del metallo e quelle della plastica, offrendo vantaggi considerevoli in termini di leggerezza, flessibilità di design e costi di montaggio
