22.08.2013
Clariant unterzeichnet langfristige Vereinbarungen mit Lummus Novolen Technology über die gemeinsame Entwicklung und Vermarktung von Polypropylen-Katalysatoren
Muttenz, 22. August 2013 – Clariant, ein weltweit führendes Unternehmen der Spezialchemie, hat heute bekannt gegeben, dass seine Geschäftseinheit Catalysts langfristige Kooperationsvereinbarungen mit CB&Is Lummus Novolen Technology GmbH unterzeichnet hat. Die beiden Unternehmen werden ihre F&E-Anstrengungen kombinieren und intensivieren, um verbesserte Polypropylen-Katalysatoren und Donor-Technologien zu entwickeln. Sobald sie erfolgreich sind, werden bestehende und künftige Lizenznehmer von Novolen und andere Polypropylen-Hersteller mit den neuen Katalysatoren, die in einer neuen, modernen Produktionsanlage zur Herstellung von Ziegler-Natta-Katalysatoren entwickelt werden, beliefert.
20.08.2013
Innovation excellence of Polyscope during K-fair 2013
At K2013, Polyscope, the world's leading producer of styrene maleic anhydride (SMA) copolymers and compounds, will display some of its most recent developments in engineering plastic applications. In addition, the company is staging a series of technical sessions at its booth in Hall 5/stand E08.
20.08.2013
DSM's Stanyl ForTii enables LOTES breakthrough in memory connectors for servers
The leading Taiwanese memory connector manufacturer LOTES Co., Ltd. has selected DSM's Stanyl® ForTii™ H11 polyamide 4T for housings for a new range of connectors for the next generation of computer memories, known as DDR4. These connectors will meet OEM design needs in a range of devices, including servers, desktops, and voice gateways.
20.08.2013
DSM's high performance Stanyl ForTii polyamide is key to LOTES DDR4 memory connector breakthrough
The leading Taiwanese memory connector manufacturer LOTES Co,, Ltd. has selected DSM's Stanyl® ForTii™ H11 polyamide 4T for housings for a new range of DDR4 connectors. T/H type and also SMT, Single-latch, VLP, ULP and Press-fit types will meet OEM design needs in servers, desktops, complex base station and voice gateways. The housings are suitable for wave and infrared reflow soldering, and are available in various colors.
19.08.2013
EMG Commits Cash and Issues Global Challenge to Help Build a School
Bergen op Zoom, August 19, 2013 – EMG, the leading international B2B communications agency specialized in industrial media relations programmes, today announced it’s Step for Schools campaign. The team hopes to get fit, make their contribution count and encourage others to do the same. Steps for Schools is a one month charity-based fitness campaign designed to promote an active lifestyle and to raise money to support Schools For Salone, a non-profit organization dedicated to transforming lives by building schools in Sierra Leone. EMG’s Steps for Schools campaign will raise money for the Gbumbeh Primary School.
19.08.2013
Bonität von Songwon aufgrund solider Geschäftsergebnisse, Wachstum und Stabilität auf BBB+ heraufgestuft
Ulsan, Korea – 19. August 2013 – Songwon Industrial Co., Ltd. (www.songwon.com) gibt bekannt, dass die beiden wichtigen koreanischen Ratingagenturen Korea Investors Service und Korea Ratings Corporation das Unternehmen auf BBB+ heraufgestuft haben. Im Ausblick wird die Bonität von Songwon aufgrund der soliden Geschäftsbasis, des guten Cashflow-Potentials und der vorhandenen Finanzreserven für geplante Investitionen als „Stabil“ bezeichnet. (Source Korea Investors Service)
14.08.2013
Clariant Molybdenum-Filled Nylon Compounds Lend Lubricity and Toughness to Molded Products
Charlotte, August 14, 2013 - Clariant, a world leader in specialty chemicals, today announced the availability of injection-molding grades of molybdenum-disulfide-filled nylon 66 compounds that are ideal for applications requiring toughness, high compressive strength and lubricity. Mechanical properties of the material are impressive.
13.08.2013
DSM and Cicor improve access security in banking industry with Stanyl ForTii
Royal DSM, the global Life Sciences and Material Sciences company, announces a breakthrough for the use of Stanyl ForTii, its high performance polyamide 4T, in three-dimensional molded interconnect devices, 3D-MIDs in the field of data security in banking. The robust plating performance of Stanyl ForTii combined with its high strength & stiffness at elevated temperatures, give designers the freedom to condense their designs.
